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Honeywell, NXP Apply AI to Autonomous Flight

Feb. 4, 2025
The two firms hope to speed development of autonomous flight systems by leveraging NXP's efficient, multifunction chipsets.

Already working as partners, Honeywell and NXP Semiconductors chose the recent Consumer Electronics Show (CES) 2025 to announce further extensions of their collaboration (see image above).

The firms reported plans for increased application of artificial intelligence (AI) to improve the operational efficiency of aerospace and defense (A&D) electronic systems. The extended teamwork is expected to accelerate the development of autonomous flight systems through the development of highly efficient, multiple-function chipsets. 

As an example, the companies hope to increase long-term values for aircraft manufacturers and operators through enhancements in large-area displays in aircraft cockpits. Using thinner, higher-resolution display screens, they hope to improve visual clarity and operator control as well as enable the use of newer avionic technologies. 

Vimal Kapur, chairman and chief executive officer (CEO) of Honeywell, feels the two companies work well together. He said, “Our industrial domain expertise combined with NXP’s best-in-class technology is a powerful accelerator for industrial leaders on the path to autonomy.”

Kapur added, “Working together, we are developing differentiated solutions and services that shape the future of automation, driving significant customer outcomes and fueling Honeywell’s growth.”

Honeywell leverages advanced NXP processors in its Honeywell Anthem products as part of developing a network-cloud-connected cockpit system with outstanding cybersecurity for mission-critical applications.

Kurt Sievers, president and CEO of NXP Semiconductors, said, “NXP’s broad portfolio and systems solutions approach makes us a natural partner for Honeywell on the journey to create innovative, intelligent, and autonomous avionics that can sense, think, and act.”

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About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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