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LPKF Debuts Clean-room Fab for Glass Microstructure Components

Dec. 10, 2020
The new facility processes thin glass for making microsystems, sensors, display components, and microchips.

LPKF has begun production in its newly built clean-room fab for manufacturing glass components at the company's headquarters in Garbsen.

In the LIDE fab, thin-glass components are manufactured for electronics and semiconductor industry applications. With the company’s laser-induced deep etching (LIDE) technology, it is possible to process thin glass quickly, precisely, and without any surface damage such as micro cracks, so that the physical stability of the glass remains fully intact. This technology enables the use of glass as a material for manufacturing microsystems, sensors, display components, and microchips.

LIDE technology is a two-step process characterized by the ability to create deep structures in thin glass with a high aspect ratio in the range of >1:10 at a highly-economical processing speed not seen before. Structures as small as <5 μm can be created.

In the first step, the glass is locally modified by laser pulses according to the desired layout. In LIDE, a single laser pulse is sufficient to modify glass substrates through their entire thickness, making it compatible with high-volume production.

In the second process step, the modified areas of the glass are removed by wet chemical etching much more rapidly than the unmodified material is.

The new clean-room glass fab enables easy access to our technology for a broad set of customers across industries, who now have access to structured thin-glass components from LPKF for their high-volume applications.

More information about LPKF’s precision glass processing service and new clean-room fab is available at www.vitrion com.

LPKF Laser & Electronics N.A., www.lpkfusa.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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