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DuPont Opens New Ohio Aerospace Technology Center

April 10, 2019
The company has opened a new Aerospace Technology Center at the DuPont Vespel manufacturing site in Valley View, Ohio.

DuPont Transportation & Advanced Polymers (DuPont) has opened a new Aerospace Technology Center at the DuPont Vespel manufacturing site in Valley View, Ohio. This site features advanced testing capabilities, customized laboratories, and a full manufacturing operation in support of commercial and military aircraft engine manufacturers around the world. The site will use advanced products and technologies for wear, friction, and sealing applications to enhance the performance of current and emerging aerospace system designs. It will also make possible collaborative demonstrations and technical training of advanced materials-based products for aerospace.

DuPont recently celebrated the opening of the new facility with customers, suppliers, and employees. “Innovation and collaboration are the keys to meeting the rapid pace of change and growth in the aerospace industry,” said Randy Stone, president, DuPont Transportation & Advanced Polymers. “We are excited to welcome our customers and suppliers to this new Technology Center to help them experience firsthand how new advances in technology can help us all capitalize on new opportunities and drive industry growth.”

“We are excited that the new Technology Center will help strengthen the state-of-the art operations at our Valley View facility,” added Jana Green, DuPont Valley view plant manager. “The investment we are making in our people, and at our site, help build pride and confidence in our commitment to safely produce composite parts for aerospace and specialty industrial applications, now and in the future.”

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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