- Low exotherm, long working life
- Applicable in very thin bond lines
- Excellent flow properties
- Superior dimensional stability
Master Bond EP29LPTCHT is a two-component epoxy system featuring good thermal conductivity along with being electrically isolating. It has convenient handling with a forgiving 100 to 50 mix ratio by weight. It is a lower viscosity material with excellent flow properties. It generates very little heat even when mixing larger masses. Not surprisingly, it has a very long open time as indicated below. The recommended cure schedule is overnight at room temperature followed by 4-5 hours at 160°-180°F. Also noteworthy is its very low shrinkage upon curing and dimensional stability.
Especially important is the very fine particle size of the thermally conductive filler. When used as an adhesive, this allows bond line thicknesses ranging from 5 to 15 microns, if desired. This translates into significantly lower thermal resistance ranging from 12-15 x 10-6 K•m2/W. Another plus is its low exotherm and good flow. Therefore the epoxy is a viable candidate for large potting and encapsulation.
This epoxy bonds well to a wide variety of substrates including metals, glass, ceramics, and many different plastics. EP29LPTCHT is a very good heat conductor while retaining reliable electrical insulation values. It is resistant to water, fuels, and oils. Part A is off-white and Part B is white. The service temperature range is -60°F to +350°F. To summarize, EP29LPTCHT is best utilized in specialty bonding applications where a low viscosity, longer working life epoxy has an exceptionally low thermal resistance.
- Lower viscosity and excellent flow properties
- Long working life at ambient temperatures
- Exceptionally low thermal resistance
- Good electrical insulator
- Ideal for underfill applications
- Meets NASA low outgassing