Substrates Support Power Packages

Oct. 14, 2010

A new line of direct bond substrates based on Curamik DBC direct-bond-ceramic (DBC) materials from Remtec, Inc. supports a wide range of power applications. By combining the DBC and plated copper on thick film (PCTF) technologies, circuit and package designers have a proven material for highly reliable designs. Available in a range of copper thicknesses from 0.0005 to 0.012 in. copper thickness, the substrates are supplied in nominal copper thicknesses of 0.005, 0.008, and 0.012 in. on 5.0 x 7.0 alumina and aluminum nitride cards.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.