The RO4460 prepreg circuit material from Rogers Corp. is an ideal match for the firm's RO4360 laminate for fabricated high-frequency, high-performance multilayer circuits. Both materials feature dielectric constant (Dk) of 6.15 0.15 and low dielectric loss of 0.003 at 2.5 GHz. The prepreg and laminate materials are ceramic-filled, thermoset materials reinforced by woven glass for excellent mechanical stability. The laminate and prepreg supports smaller size circuits with excellent thermal conductivity of 0.8 W/m-K for effective thermal management. RoHS-compliant RO4360 laminate and RO4460 bondply materials offer low coefficient of thermal expansion (CTE) of 30 ppm/C in the z-axis for reliable plated through holes (PTHs) in multilayer circuits. The RO4360/RO4460 laminate system supports low-cost FR-4-type processing. In addition, the prepreg can be used with epoxy-based materials for compact hybrid multilayer circuits.
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