Prepregs Match 6.15-Dk Laminates

July 28, 2010
The RO4460 prepreg circuit material from Rogers Corp. is an ideal match for the firm's RO4360 laminate for fabricated high-frequency, high-performance multilayer circuits. Both materials feature dielectric constant (Dk) of 6.15 0.15 and low dielectric ...

The RO4460 prepreg circuit material from Rogers Corp. is an ideal match for the firm's RO4360 laminate for fabricated high-frequency, high-performance multilayer circuits. Both materials feature dielectric constant (Dk) of 6.15 0.15 and low dielectric loss of 0.003 at 2.5 GHz. The prepreg and laminate materials are ceramic-filled, thermoset materials reinforced by woven glass for excellent mechanical stability. The laminate and prepreg supports smaller size circuits with excellent thermal conductivity of 0.8 W/m-K for effective thermal management. RoHS-compliant RO4360 laminate and RO4460 bondply materials offer low coefficient of thermal expansion (CTE) of 30 ppm/C in the z-axis for reliable plated through holes (PTHs) in multilayer circuits. The RO4360/RO4460 laminate system supports low-cost FR-4-type processing. In addition, the prepreg can be used with epoxy-based materials for compact hybrid multilayer circuits.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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