Content

Rogers Shows Materials At DesignCon 2010

Jan. 14, 2010

Rogers Corporation will feature a strong lineup of electronic materials at the upcoming DesignCon 2010 in Santa Clara, CA (Feb. 2-3, 2010, Santa Clara Convention Center). The materials will include ULTRALAM 3000 laminates, RO2808 laminates, and RO4000 LoPro circuit board materials. ULTRALAM 3000 laminates and bond ply materials exhibit low loss and high reliability for cost-effective, high-volume circuit-board production environments. RO2808 laminates blend consistent dielectric-constant characteristics with the low profile needed for compact circuit designs and are suitable replacements for low-temperature-co-fired-ceramic (LTCC) circuits in low-cost electronic designs. RO4000 LoPro laminates, with their low-profile copper foil with RO4000 dielectric material, are ideal for both high-speed digital and high-frequency analog applications.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.