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Palomar Sheds Light On Packaging At SEMICON

July 10, 2008

Automated packaging specialist Palomar Technologies will be sharing some secrets at the upcoming SEMICON West show (July 15-17) next week. In addition to showing its systems and processes for automatic packaging of optical and microelectronic devices and components, the firm's Senior Scientist, Dan Evans, and Systems Engineer, Albert Perez, will be presenting "Chain Wire Bonding of a RF-SOE Package Using a Gold Ball Bonder" the day before SEMICON West at the IMAPS/SEMI Advanced Technology Workshop.

Palomar is a major supplier of automated high-precision wire bonders and component placement systems along with process development and contract assembly services to increase yield and lower costs for manufacturers.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.