Rogers Airs Laminates, Thermal Materials At DesignCon 2009

Feb. 5, 2009

The Advanced Circuit Materials Division (ACMD) and its newly formed Thermal Management Solutions (TMS) Division of Rogers Corp. will be exhibiting RO4000, RO2808, and ULTRALAM 3000 high-frequency laminates and HEATWAVE and COOLSPAN thermal management materials at the upcoming DesignCon 2009 show, scheduled for Feb. 3-4, 2009 at the Santa Clara Convention Center (Santa Clara, CA). The laminates are well suited for high-performance analog and data-transmission application in computer, telecommunications, and wireless communications applications while the thermal management solutions are ideal for controlling heat in semiconductor packaging and power amplifiers.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.