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A Design FAQ From MWRF: Wafer-Scale Packaging

May 27, 2010

Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an ICa package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to create packaged circuits as small as 1 x 2 mm, with improved performance compared to conventional IC packages. The low height of WSP devices also makes them ideal for use in multilayer circuits. The packaging technology has already been used for ICs through 26 GHz, with the potential for operation past 100 GHz.

To learn more about WSP technology, don't miss this new FAQ, sponsored by Avago Technologies. Read now.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.