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Broadcom Taps LitePoint for Verification of New Wi-Fi 7 Chipsets

May 26, 2022

LitePoint's IQxel-MX platform supports Wi-Fi 7's Multi-Link Operation functionality as well as high-order MIMO testing.

To ensure performance and accelerate verification of access points based on its new Wi-Fi 7 chips, Broadcom has chosen LitePoint's IQxel-MX test platform, which enables comprehensive validation of key new Wi-Fi 7 access point and client features. The validation and verification processes are critical to ensuring high-speed and low-latency communications in support of next-generation applications such as augmented reality (AR) and virtual reality (VR).

For residential and enterprise users, the nascent Wi-Fi 7 (IEEE 802.11be) standard offers higher throughput, reduced latency, and higher reliability. Many key enhancements to the standard make those features possible, including 4096-QAM modulation, extra-wide 320-MHz channels, and flexibility to operate in all three frequency bands.

Multi-Link Operation (MLO) further increases Wi-Fi’s capability to operate in high-density congested environments. It allows access points to schedule transmissions on multiple links to optimize bandwidth, latency, and range.

The IQxel-MX is optimized to validate a device’s wireless signal quality and optimal operation over multiple links and multiple bands. Thus, it's suited for accelerated development of next-generation Wi-Fi access points that utilize Broadcom’s Wi-Fi 7 chipsets.

LitePoint's IQxel-MX is a fully integrated RF PHY test solution with signal generation and analysis combined in a single tester, supporting a continuous frequency range from 400 MHz to 7.3 GHz. The platform offers an analysis bandwidth of 320 MHz and a very low residual error-vector-magnitude (EVM) floor. Its signal-combination architecture supports MLO without external hardware as well as high-order MIMO testing.

The IQxel-MX addresses the requirements of the IEEE 802.11be (Wi-Fi 7), 802.11ax (Wi-Fi 6, Wi-Fi 6E), and IEEE 802.11 legacy specifications, as well as a full range of connectivity standards (Bluetooth 5.x, Zigbee, Z-Wave).

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.