0921 Mw Rohde And Cadence Vsesim Vss Tool Promo 613b6ffb0329e

Signal Creation/Analysis Tool Melds EDA Simulation with Hardware Test

Sept. 10, 2021

Rohde & Schwarz and Cadence cook up a signal creation and analysis tool that hastens the development process for RF components.

David Maliniak

Related To: Microwaves & RF

With new wireless and satellite technologies encompassing ever-wider frequency ranges and increasingly demanding requirements, it’s paramount to perform realistic signal simulation at the early stages of RF system design. Using the same signal creation methods and analysis algorithms as for subsequent hardware testing enables direct result correlation from the early design stages to implementation verification, allowing conclusive and consistent analysis of widely-used key performance indicators such as error vector magnitude (EVM).

To this end, Rohde & Schwarz has collaborated with Cadence Design Systems to develop the R&S VSESIM-VSS signal creation and analysis tool, which supports all major standards such as 5G, the latest Wi-Fi incarnations, and many more. The joint solution combines signal generation, design simulation, and signal analysis, building on the strengths of both companies’ proven solutions. As a result, developers and design engineers benefit from an optimized tool that allows them to address design challenges earlier than before in the development process.

The R&S VSESIM-VSS signal creation and analysis tool functions as an addition to the Cadence Visual System Simulator (VSS) software, an established solution for system simulation and modeling, particularly for RF components and RF assemblies used in wireless communications and radar design. Rohde’s VSESIM-VSS expands the capabilities of the VSS software by adding realistic signals to the workflow, increasing simulation accuracy, and simplifying the design process. R&S VSESIM-VSS benefits from two established software tools from Rohde & Schwarz for testing operative circuits, modules, and devices—the signal-generation capabilities of the R&S WinIQSIM2 simulation software and the signal-analysis capabilities of the R&S VSE vector signal-explorer software. R&S VSESIM-VSS combines these functions and adds plug-ins for Cadence’s electronic design automation (EDA) tools.

The data sink plug-in from Rohde & Schwarz provides access to the signal at any point in the design process. The signal can be transferred to a vector signal generator and applied to available hardware, enabling system-level analysis of hybrid hardware/simulated implementations. An important feature of R&S VSESIM-VSS is support of direct digital predistortion (DPD) techniques to verify the effects of linearization already in the simulation phase of power amplifier development.

An added benefit of combining the solutions is increased compatibility between Rohde & Schwarz and Cadence tools. Signal generation and analysis provided by the Rohde & Schwarz tools can also be used in other connected Cadence products such as the Cadence Microwave Office circuit design software or the Cadence Virtuoso RF Solution for radio-frequency integrated circuits (RFIC) and RF modules.

R&S VSESIM-VSS is available from Rohde & Schwarz.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.