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Containers Speed Embedded Software Development

March 19, 2024

Learn how NXP leverages MicroEJ’s software containers with standard APIs to bring software portability to a broad range of NXP’s RTOS-based MCUs and Linux-based processors.

David Maliniak

A collaboration between MicroEJ and NXP Semiconductors has resulted in the NXP Platform Accelerator, which promises easier integration, faster time-to-market, scalability, and portability to users of NXP’s processors. The Platform Accelerator leverages MicroEJ’s Virtual Execution Environment (VEE) software containers with standard application programming interfaces (APIs) to deliver software portability across NXP’s broad portfolio of RTOS-based MCUs and Linux-based applications processors.

According to MicroEJ’s chief product and strategy officer, Semir Haddad, NXP realized it needed to enable application software reuse across its broad portfolio of microcontrollers and applications processors. In the video, Haddad shows an array of NXP devices all brought to application-software unity through use of MicroEJ’s VEE software containers, including:

i.MX 93 applications processor
i.MX 8M Mini multicore applications processor
RW612 wireless MCU with Wi-Fi 6, Bluetooth LE, and 802.15.4 radios
i.MX RT1170 1-GHz MCU based on Arm Cortex

The sampling of NXP devices spans environments from RTOS to Linux and even Android, all unified through use of the Platform Accelerator. As a result, NXP customers can develop a single application that can be run on any/all of these devices. This brings a great deal of reuse and scalability to software development, as well as the ability to very quickly simulate and prototype the software.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.