Cadence Design Systems
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3D Transient Solver Speeds Up Large System-Level EMI Simulations

Oct. 17, 2020
System design teams can quickly and accurately simulate large and complex hyperscale, automotive, mobile, and aerospace and defense systems for EMC/EMI compliance.

In its new Clarity 3D transient solver, Cadence Design Systems provides a system-level simulation environment that solves electromagnetic interference (EMI) system design issues up to 10X faster than legacy 3D field solvers and offers unbounded capacity. Built on Cadence’s massively parallel matrix solver technology, the Clarity 3D transient solver handles workload levels that previously required time-consuming and expensive anechoic test chambers to test prototypes for electromagnetic compatibility (EMC) compliance.

The challenge of system-level EMC/EMI compliance, from both the emissions and susceptibility standpoints, is an increasingly difficult one as end products become denser, data rates rise, and systems are equipped with more wireless connectivity. The new solver is capable of simulating large designs that until now have been impractical or unable to be solved, reducing re-spins and accelerating time to market. It’s particularly applicable in growth industries such as automotive, consumer electronics, and healthcare.

The Clarity 3D Transient Solver quickly and accurately performs large-scale simulations when designing critical interconnects for PCBs, IC packages, and system-on-IC (SoIC) designs within a mechanical enclosure. It relies on Cadence’s distributed multiprocessing technology that spreads computing resources over hundreds or even thousands of cores in cloud-based computing environments. As a result, designers can move beyond the module level to simulate entire systems at speeds up to 10X faster than legacy field-solver technology while maintaining verifiable accuracy. It means less time spent in testing prototypes against EMI emissions and immunity standards such as those set by Comité International Spécial des Perturbations Radioélectriques (CISPR). The Clarity 3D Transient Solver also offers a high degree of integration with Cadence’s Virtuoso Layout, Allegro PCB Designer, and SiP Layout tools, so that issues that turn up in Clarity 3D simulations can be quickly implemented, avoiding lengthy design iterations in the signoff stage.

An early beta tester, Ultimate Technologies, has found the Clarity 3D transient solver highly effective in predicting what will be measured in EMI testing. As a result, the company reports that it’s been able to shave up to three months (or about 30%) from automotive-ECU design cycles.

The Clarity 3D transient solver is expected to be available in the first quarter of 2021. Cadence also offers its CloudBurst platform for a quick path to a hybrid-cloud computing environment.

Cadence Design Systems, www.cadence.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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