Thermoplastic Enhancements Propel Prototyping Efforts

Metal components in A&D systems are being replaced by stronger, lighter-weight parts based on Xycomp DLF composites.

Materials specialist Greene Tweed has developed an accelerated prototyping process for its Xycomp DLF material that features faster testing and validation for metal replacement development projects. By providing faster access to high-performance composite materials, critical markets in need of fast prototyping turnaround times, including aerospace and defense (A&D) and advanced air mobility (AAM), are better served.

Components employing Xycomp discontinuous long fiber (DLF) composites are geared to replace metals (see image above) while increasing strength and reducing weight of designs. 

George Rawa, general manager for structural & engineered components at Greene Tweed, noted, “Greene Tweed recognized the need for a faster, more cost-effective way to support the development of lightweight, high-performance components for customers. This process expedites the timeline to evaluate Xycomp composites in real-world applications by putting production-quality parts in engineers’ hands in a fraction of the time.”

Adoption of the composite materials due to rapid-prototyping needs is quickly growing across markets. Custom-engineered electric vertical take-off and landing (eVTOL) applications are among the latest to benefit from such process enhancements as custom mold formation.

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About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.