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The evolution of microwave and RF systems is being driven by demands for higher bandwidth, lower latency, improved power efficiency, and operation in increasingly constrained and hostile environments. While semiconductor technologies like GaN, SiGe, and advanced CMOS enabled dramatic gains in device performance, the interconnect structures that link these devices into functional systems haven’t advanced at the same pace.

In fact, at microwave and mmWave frequencies, the interconnect often becomes the dominant limiter of system performance. Against this backdrop, solderless assembly processes using direct copper interconnection to component terminals (such as the Occam process) represent a fundamentally different approach that may be well-suited to RF and microwave applications going forward.