PXI/PXIe microwave multiplexer modules span 8 GHz to 40 GHz

High-Channel-Count Microwave MUX Modules Span 8 to 40 GHz

June 14, 2024

The multiplexer modules, which come in various switching configurations, reduce the number of switches and associated interconnects in high-channel-count applications.

David Maliniak

Related To: Microwaves & RF

Technologies

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Pickering Interfaces will be in Booth 404 at IMS 2024 to tout its new family of high-channel-count, PXI/PXIe microwave multiplexer (MUX) modules. Models 40/42-788, based on high-quality Radiall mechanical microwave switches, offer bandwidth options from 8 to 40 GHz. The modules also come in versatile switching configurations, including single or dual SP8T, SP10T, or SP12T multiplexers.

The devices handle microwave switching applications along with many uses across the RF spectrum calling for extremely low insertion loss and ultra-high isolation. Their high channel counts mean fewer switches and associated interconnections being required for microwave switching applications, improving signal quality and ease of programming.

Other products featured in Pickering’s IMS Booth 404 include:

MEMS-based PXI/PXIe RF multiplexers that deliver 300X operational life and 60X test system throughput compared to existing electromechanical relay products.
A 110-GHz PXI/PXIe microwave switch that supports 5G and semiconductor test.
A configurable PXI microwave switch platform that enables RF test engineers to combine a wide range of high-performance relay types while minimizing chassis slot usage.
Pickering’s Microwave Design Tool, a free online tool for configuring flexible PXI and LXI microwave switch products.
Flexible LXI microwave switch platform and turnkey services for LXI microwave switch and signal routing subsystems, as well as an LXI microwave switching matrix demo.

Browse our complete IMS 2024 coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.