Mercury Systems has received a $7.7 million follow-on order from a leading defense contractor for its BuiltSecure high-density secure memory devices. The memory devices will be integrated into an airborne command, control, and intelligence (CCI) system. The order was booked in the company’s fiscal 2018 second quarter and is expected to be shipped over the next several quarters.
BuiltSecure memory devices employ 3D packaging technology to create vertically integrated memory modules from arrays of 2D memory devices. The resulting 3D memory modules provide highly space-efficient storage capacity in physical packages that are well engineered for the harshest military operating environments, while saving as much as 85% volume within an electronic system compared to 2D memory approaches. Compact BuiltSecure memory devices free circuit-board space for additional circuitry and functions, enabling enhanced system capabilities. BuiltSecure memory devices are designed and manufactured in the company’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz.
“We are very pleased to receive this follow-on order from our valued customer for BuiltSecure high-speed memory devices,” said Charlie Leader, senior vice president and general manager of Mercury’s Advanced Microelectronics Solutions group. “With the capabilities embedded in our Phoenix AMC, Mercury delivers the most advanced commercial memory technologies in a compact form factor engineered to withstand the harshest operating conditions encountered by our warfighters.”
In a separate order, Mercury Systems received a $4.6 million follow-on order from a leading defense contractor for GPS filter amplifiers for a precision guided munitions application. The order was also booked in the company’s fiscal 2018 second quarter and is expected to be shipped over the next several quarters.
