Product Snapshot: Anaren's Xinger

Jan. 20, 2004
A new Xinger has been added to Anaren's (East Syracuse, NY) comprehensive line of compact signal-processing components. The new 3-dB hybrid coupler operates from 800 to 1000 MHz and is designed for close matching of the coefficient of thermal ...

A new Xinger has been added to Anaren's (East Syracuse, NY) comprehensive line of compact signal-processing components. The new 3-dB hybrid coupler operates from 800 to 1000 MHz and is designed for close matching of the coefficient of thermal expansion (CTE) to the most popular high-frequency substrate materials, including FR4, G-10, and laminates from Rogers Corp. and Taconics. The coupler, which measures 9 x 7 x 2.8 mm, features maximum insertion loss of 0.3 dB and minimum isolation between ports of 20 dB. In spite of its small size, it is rated to handle input power levels to 115 W. The company's wireless product line manager, Hans Peter Ostergaard, notes that "this component is well suited for AMPS and GSM900 applications, and it's even smaller than our traditional Xinger-brnad 800-1000 MHz part, so OEMs can save even more board space."

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About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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