0822 Mw Omnivision 50 Mp Sensor 62f68024ee02c

50-MP Image Sensor Ups Dynamic-Range Ante For Rear-Facing Smartphone Cameras

Aug. 12, 2022
The OV50E image sensor features 1.0-µm pixels in a 1/1.5-inch optical format with 100% PD and single-exposure, high-dynamic-range support for superior still image and video captures.

The Overview

Omnivision’s new OV50E image sensor combines 50-Mpixel resolution and 1.0-µm pixel size in a 1/1.5” optical format. Touted as offering industry-best low-light imaging and high-dynamic-range (HDR) video capture, the device is intended as a rear-facing camera module for high-end and mainstream smartphones.

Who Needs It & Why?

Video consumption is quickly becoming the predominant source of information for people, and smartphones are replacing professional equipment for video capture. However, smartphones have historically not been adept at zooming. The OV50E provides video HDR crop zoom support, which allow users to seamlessly switch between full and smaller resolution with full HDR capabilities.

Under the Hood

The OV50E features staggered HDR and Omnivision’s DCG technology for improved HDR and crop zoom support, 100% quad phase detection (QPD) for enhanced autofocus, and better low-light performance over previous-generation image sensors. Staggered HDR and the patented DCG technology extend dynamic range and reduce motion artifacts in challenging lighting conditions, and together with a built-in dual conversion gain combination, provides single-exposure HDR support. The maximum dynamic range reaches more than 100 dB.

In addition, OV50E’s second-generation QPD enables 2x2 phase-detection autofocus (PDAF) across the sensor’s entire image array for 100% coverage, resulting in improved distance calculation, faster autofocus, and better low-light performance. Premium image quality is further enabled by the combination of on-chip remosaic for the QPD color filter array to full Bayer resolution.

Omnivision can claim for the OV50E image sensor the best low-light performance in its class, thanks to its combination of a large 1.0-µm pixel size, built-in advanced noise reduction technology, and high gain mode support. The OV50E can achieve up to 64× analog gain for full resolution, or 256× analog gain for four-cell binning resolution. Built on the company’s PureCel Plus-S stacked-die technology, the OV50E can also use near-pixel binning to output a 12.5-MP image or 4K2K video with four times the sensitivity, yielding 2.0-µm-equivalent performance for preview and video. In either case, the OV50E can consistently capture the highest quality images, as well as enabling 2× digital crop zoom with smaller resolution and fast mode switch.

Output formats include 50-MP, or 8K video, with QPD autofocus at 30 frames per second (fps); 12.5 MP with QPD autofocus at 60 fps; 4K2K video with QPD autofocus at 60 fps; and 1080p at 240 fps. The OV50E supports the CPHY/DPHY MIPI interface and dual DOVDD 1.8/1.2v.

OV50E samples will be available in Q3 2022.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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