Broadband connectivity is a near-ubiquitous feature of modern life, but achieving it requires great attention to detail, even very small details. Consider, for example, a component like fixed chip attenuators, which must deliver on power and frequency specifications for broadband systems to perform as expected. Smiths Interconnect hopes to help designers cross that detail off their lists with its new TSX series of fixed chip attenuators, which are optimized to combine high frequency and power in a small package.
The TSX attenuators are designed to offer excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0604 surface-mount package. The devices offer wider frequency coverage than traditional components while providing optimized return loss for multiple frequency ranges. Thus, designers may use a single chip in multiple applications, reducing the bill-of-materials (BOM) item count and consequently, the cost of ownership.
The chip attenuator design, available for surface mounting, offers 1 to 3 W of power handling performance and multiple attenuation values of 1 to 10, 15, and 20 dB. The use of a robust, proven all-thin-film process technology on an alumina substrate provides a product suitable for harsh environments, such as those of space and defense applications.
With the reductions in size and weight and boost in power handling, the TSX components fit into a wide range of applications. They provide high attenuation accuracy and reduce overall design footprints, saving space in all manner of designs. Each product is engineered using 3D electromagnetic simulation (EM) software to provide excellent performance.