Time-of-Flight Sensors Address Advanced 3D Depth Sensing
STMicroelectronics released the VL53L9, an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR module with a resolution of up to 2.3k zones, with integrated dual-scan flood illumination to detect small objects and edges in both 2D infrared images and 3D depth map information. The low-power module has on-chip dToF processing, requiring no extra external components or calibration, to deliver state-of-the-art ranging performance from 5 centimeters to 10 meters. Features include camera-assist performance supporting macro up to telephoto photography, along with laser autofocus, bokeh, and cinematic effects for still and video at 60 fps. The sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality.
The VD55H1 ToF sensor addresses machine-vision applications, 3D webcams, 3D reconstruction for VR headsets, people counting, and activity detection in smart homes and buildings. With 672 x 804 sensing pixels in a tiny chip size, it can map a three-dimensional surface by measuring distance to over half a million points. A stacked-wafer manufacturing process with backside illumination enables a high level of resolution in a smaller die size with lower power consumption than alternative iToF sensors in the market.
Related links:
STMicroelectronics
VL53L9 dToF 3D LiDAR module
VD55H1 ToF sensor
