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RF SOI Platform Promises Next-Gen Monolithic Integration

June 16, 2025

The new technology is said to deliver orders-of-magnitude improvements in RF and mixed-signal performance.

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Browse our complete IMS 2025 coverage.

pSemi comes to IMS 2025 (Booth #443) to show off UltraCMOS+, which is its latest breakthrough in RF silicon-on-insulator (SOI) platform technology. According to the company, this RF SOI platform will produce pSemi’s next generation of monolithic integration with vast improvements in power handling, linearity, isolation, R_ON, C_OFF, integrated intelligence, and, ultimately, portfolio expansion.

As the single source of advanced silicon-on-sapphire (SOS), pSemi has developed a unique team of process engineers, IC designers, and software engineers to advance the technology. The result is the development of the UltraCMOS+ RF SOI platform, which includes proprietary semiconductor processes, product development kits (PDKs), simulation software, and unique circuit techniques.

Over the last decade, pSemi transitioned its focus from SOS to SOI but maintained its team and continued the advancement of UltraCMOS. The pSemi team and company culture enabled the rapid development of 16 generations of UltraCMOS, expanding the usage model while also optimizing performance for targeted RF functions.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.