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    RF-over-Fiber Links Claim Best-in-Class Noise Figure and Link Gain in Wideband Systems

    May 8, 2025
    Photonic Systems' solution maintains signal fidelity across its full bandwidth while reducing noise and the need for additional RF amplification.
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    With its new generation of RF-over-fiber (RFoF) links, Photonic Systems Inc. offers a solution that’s optimized for wideband RF systems operating from 0.1 to 20 GHz. The PSI-2800-20L Series of RFoF links sports a noise-figure improvement of >15 dB and link-gain enhancement of >15 dB over previous generations. They're said to give RF system designers a means of boosting performance while reducing overall system complexity.

    Intended for defense, telecom, and high-performance RF applications, the PSI-2800-20L Series maintains signal fidelity across its full bandwidth while minimizing noise and reducing the need for additional RF amplification. Their wideband coverage supports the L-, S-, C-, X-, and Ku-bands as well as portions of the K-band with consistent, high-fidelity performance.

    The RFoF links’ noise-figure improvement supports a lower system noise floor, which enhances dynamic range and sensitivity in electronic-warfare, signals-intelligence (SIGINT), and high-resolution radar applications. Their link-gain enhancement delivers higher output power and often eliminates having to add RF amplification, which helps reduce system complexity. The link units are small in form factor and ready for integration into rack-mounted or embedded systems needing to save weight and space.

    Related links:

    PSI-2800-20L Series datasheet

    Photonic Systems Inc.

    About the Author

    David Maliniak | Executive Editor, Microwaves & RF

    I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

    You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

    About me:

    In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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