Semiconductors and microelectronic devices are being incorporated into many major application areas, from automobiles to telecommunications networks. One concern with growing demand is too many users and not enough workers.
Fortunately, Purdue Universityand its College of Engineering have extensive experience working with government organizations and other universities and offer educational programs designed to prepare students for careers in microelectronics and semiconductors (see the figure), from design and simulation to fabrication and test. Some of the course content has been summarized inn a recent roundup available from the university, “Semiconductors and Microelectronics.”
Purdue has been selected by the National Institute of Science and Technology (NIST) to define future needs for semiconductors and their packaging. Other circuit design goals target high circuit density, miniaturization, and security. The roundup lists the many other universities that team with Purdue to provide the comprehensive postgraduate education in microelectronics and semiconductors expected to be needed for the next generation of electronics engineers.
As examples, the roundup presents locales at which courses of study can be pursued, including in radiation hardening, heterogeneous integration, advanced packaging, and system-on-chip (SoC) technology. Students learn strategies for adopting each technology to modern needs, such as reduced size, weight, and power (SWaP), miniaturization, and the capability to deliver maximum performance levels even in hostile environmental conditions.