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Caseframe Family of Electronic Chassis and Enclosures Targets 3U/6U Boards

Jan. 25, 2021
The chassis and enclosures enable users to build application-specific designs, reduce time to market, and help minimize non-recurring engineering costs.

This article appeared in Military & Aerospace Electronics and has been published here with permission.

Verotec Inc. recently introduced the Eurotec caseframe family of electronic chassis for standard 3U and 6U printed circuit boards (PCBs) or modules that need a desktop, 19-inch rackmount, or portable enclosure.

Standard depths are 240, 360, and 480 mm, and backplane or DIN41612 connector rear extrusions can be specified. The core design is finished with front trims and latching feet for desktop instrumentation use.

The chassis is fitted with standard 19-inch earpieces for rack mounting and the portable units have a locking carry handle. The top and bottom covers can be removed for system building and servicing.

Three thermal-management options are available. For low power applications, the 3U and 6U units have unventilated top and bottom covers. 4U and 7U versions are fitted with additional half-U high ventilated covers that offer enhanced convection cooling.

High-power applications can use the 5U and 8U versions, which are fitted with a half-U ventilated top cover and a 1 1/2U bottom cover with a front filter unit that accepts a fan tray for forced air cooling. EMC screening kits that provide enhanced attenuation levels are available.

Other options for these enclosures include vented and fan rear panels as an alternative to using the bottom fan tray version. The use of standard KM6 subrack components means that Eurotec is fully compatible with KM6-II card guides, front panels, plug-in units, and accessories.

These elements enable users to build application-specific designs from standard components, reduce time to market, and help minimize non-recurring engineering costs.

Verotec, www.verotec.co.uk

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