Joe Fjelstad

Joseph Fjelstad has been active in electronics manufacturing since 1972 in roles including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. patents and numerous foreign ones, and is an internationally recognized expert, inventor, and lecturer in electronics interconnection technology. Fjelstad is also a veteran of several startup companies, including Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now Adeia).

Many of Fjelstad’s innovative devices and reliability-enhancing IC packaging features are found in nearly every electronic device made today. He’s also the author, co-author, or editor of several books on interconnection technology, including Flexible Circuit Technology, 4th Edition, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics—The SAFE Approach (the Occam Process). Over the past five decades, he has written hundreds of articles, columns, and commentaries for industry magazines and journals.