Rogers To Aid Circuit And Thermal Designers At IMS

May 6, 2010

Materials supplier Rogers Corporation plans to exhibit at the 2010 IEEE International Microwave Symposium with both printed-circuit-board (PCB) and thermal-management solutions. Rogers Advanced Circuit Materials (ACM) Division will show RT/duroid 5880LZ, RT/duroid 6202PR, and RO4360 laminate materials while the company's Thermal Management Solutions (TMS) Division will show its HEATWAVE metal matrix composites. The trade show (www.ims2010.org), the RF/microwave industry's largest event, is scheduled for May 25-27, 2010 at the Anaheim Convention Center, Anaheim, CA.

RT/duroid 5880LZ is a PTFE-based composite with unique filler for applications requiring low-density, light-weight circuit boards. RT/duroid 6202PR laminates offer outstanding dimensional stability of 0.05 to 0.07 mils/in. for stable planar resistors, resonators, filters, and other high-frequency circuits. RO4000 glass-reinforced thermoset materials can be processed in automated assembly lines just like FR-4. The product line includes RO4360 with dielectric constant of 6.15 at 2.5 and 10 GHz for miniature printed antennas.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.