Tiny Chip Baluns Cut Insertion Loss To 0.6 dB

April 12, 2007
Multilayer chip baluns have emerged to tackle the impedance matching between equilibrium/nonequilibrium circuits in RF circuits for WiMAX communications equipment. At 1.6 X 0.8 X 0.6 mm, these multilayer baluns boast an insertion loss of 0.6 dB ...

Multilayer chip baluns have emerged to tackle the impedance matching between equilibrium/nonequilibrium circuits in RF circuits for WiMAX communications equipment. At 1.6 X 0.8 X 0.6 mm, these multilayer baluns boast an insertion loss of 0.6 dB and bestin-class frequencies of 2.5 and 3.6 GHz. To achieve low insertion loss in a 1608 size, the baluns leverage low-temperature firing materials and a multilayer pattern. The AMB1608C 2500Z05, for example, operates from 2300 to 2700 MHz. Its impedance—both balanced and unbalanced—is 50 Ω. Return loss is 15 dB typical. Amplitude balance is 1.0 dB typical. Its sibling, the AMB1608C 2500Z10, has many of the same specifications. The only difference is its balanced impedance, which is 100 Ω. The AMB1608C 3600Z05 and AMB1608C 3600Z10 offer balanced impedances of 50 and 100 Ω, respectively. They operate from 3300 to 3900 MHz. Samples of the baluns will begin shipping this month.

FDK Corp., Hamagomu Bldg., 5-36-11 Shimbashi, Minato-ku, Tokyo 105-8677; +81-3-3434-1271, FAX: +81-3-34341375, Internet: www.fdk.com

About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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