Rogers Shows Advanced Materials At DMC 2010

Nov. 24, 2010
Rogers Corporation will be exhibiting at the upcoming Defense Manufacturing Conference 2010 (DMC 2010) in Las Vegas, NV this November 29-December 1, with a collection of its high-performance circuit materials. Materials will include RT/duroid 6202PR and ...
Rogers Corporation will be exhibiting at the upcoming Defense Manufacturing Conference 2010 (DMC 2010) in Las Vegas, NV this November 29-December 1, with a collection of its high-performance circuit materials. Materials will include RT/duroid 6202PR and RT/duroid 5880LZ, as well as an unveiling of the new XT/duroid 8000 and 8100 materials. RT/duroid 6202PR laminate features a relative dielectric constant of 3.00 at 10 GHz and low dissipation factor of 0.002 at 10 GHz. RoHS-compliant RT/duroid 5880LZ high frequency laminate materials are engineered for weight-sensitive applications, such as airborne antennas, with a low dielectric constant of 1.96 at 10 GHz. New XT/duroid 8000 laminates are suitable for severe environments, with low thermal coefficient of dielectric constant of +7 ppm/deg. C and dielectric constant of 3.23 at 10 GHz. Compatible with lead-free-solder processes, these reliable laminates have low outgassing characteristics for use in space-based, vacuum environments.

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