COMPANY OVERVIEW
About ED2 Corp.
Contact
Tucson, AZ 85704
United States of America
More Info on ED2 Corp.
Having designed and developed a variety of products in and around the RF space, ED2 brings a unique combination of commercial, defense, and senior leadership to the productization process.
ED2 designs are geared for high volume manufacturing, lowest cost and best performance.
Designs range from electronics and wireless communications. Electronics ranges from processors and/or FPGA’s based designs with power management to power management and packaging. Wireless designs range from IoT protocols (i.e. LoRA, BLE, BL, Zigbee…) to LTE connectivity for gateway applications to using Wi-Fi and sensors. ED2 is able to design RF components and wireless links from 20MHz to 94GHz.
ED2 has pioneered the use of fused silica in heterogeneous semiconductor packaging. We call this Advanced Glass Packaging Technology (AGPT™).
A heterogeneous semiconductor package combines multiple different types of semiconductor materials or technologies within a single package. This can include a combination of materials, such as silicon and compound semiconductors, or a combination of different types of semiconductor devices, such as transistors and diodes.
Heterogeneous semiconductor packages offer several benefits over traditional homogeneous packages, which are made from a single type of semiconductor material or technology. One key benefit is that they allow for the integration of multiple different functions within a single package, which reduces size and complexity of electronic systems. Heterogeneous semiconductor packages improve performance by allowing different functions to be optimized for their respective materials or technologies.
Examples of heterogeneous semiconductor packages include system-in-package (SiP) and multi-chip modules (MCM). These packages are commonly used in a wide range of electronic applications, including smartphones, computer systems, and other consumer and industrial electronics.
- High temperature Resistance
- Coefficient of Thermal Expansion (CTE)
- Low Dielectric Loss
- Low Outgassing
- RAD Hard
- Scalable Manufacturing
