Remtec

Over decades of experience in volume manufacturing, Remtec has refined our patented process for combining plated copper images with thick film on ceramic substrates—a technology we call Plated Copper on Thick Film (PCTF®). This technology enables us to achieve high levels of product uniformity, yield consistency, reliability, and product performance. In fact, with over 100 million gold and aluminum wire bond connections and more than 1 billion solder joint connections, Remtec products have been successfully field-tested across numerous industries without reported failure.

At Remtec, we turn your packaging and assembly problems into effective, reliable, and lasting solutions.