This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.
Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high speed communication and advanced power management. Developers can become familiar with all these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).
A custom circuit board is still needed but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches and advantages of SIP technology for embedded developers.
Explore cascaded amplifiers, revealing how a single driver can dominate performance in a four-parallel setup and how optimized input power can reduce AM-to-PM distortion for maximum...
See how an X-band SSB upconverter built with Mini-Circuits components uses IQ mixing to suppress unwanted sidebands and boost spectral efficiency for applications from 5G to radar...
Mini-Circuits VP of Engineering Joe Merenda explains additive phase noise (APN) in RF amplifiers, covering theory, measurement, specifications, and small vs. large signal behavior...
The new M4SWA4-34DR+ SP4T MMIC switch delivers fast, wideband signal routing from DC to 30 GHz, with superior power handling, quick switching, and cost advantages over SOI devices...
