What’s Next For ST-Ericsson

April 3, 2013
In closing down the remaining parts of ST-Ericsson in the early part of 2013, Ericsson and STMicroelectronics believe they have found a strategy that maximizes their respective future prospects and growth plans.

After failing to successfully raise semiconductor business in Europe, Ericsson and STMicroelectronics have agreed on a plan to split up their joint venture, ST-Ericsson. Ericsson will take on the design, development, and sales of the Long Term Evolution (LTE) multimode thin modem products, including those for second-, third-, and fourth-generation (2G, 3G, and 4G) multimode applications. STMicroelectronics will handle the other existing ST-Ericsson products, as well as related business and certain assembly and test facilities.   

After the split, it is proposed that Ericsson will assume responsibility for approximately 1800 employees and contractors, which have the largest concentrations in Sweden, Germany, India, and China. ST is expected to assume approximately 950 employees—primarily in France and Italy. With this change, Carlo Ferro, the firm’s current Chief Operating Officer, has been appointed President and Chief Executive Officer of ST-Ericsson. Ferro will lead the work in securing both business continuity of ST-Ericsson and effective completion of the transition phase.

With the proposed transfer of competencies from ST-Ericsson, ST expects to strengthen its capabilities in the areas of application processors, RF, analog, and power design and integration as well as software and complex system integration. The formal transfer of the relevant parts of ST-Ericsson to the parent companies is expected to be completed during the third quarter of 2013, subject to regulatory approvals.

About the Author

Nancy Friedrich | Editor-in-Chief

Nancy Friedrich began her career in technical publishing in 1998. After a stint with sister publication Electronic Design as Chief Copy Editor, Nancy worked as Managing Editor of Embedded Systems Development. She then became a Technology Editor at Wireless Systems Design, an offshoot of Microwaves & RF. Nancy has called the microwave space “home” since 2005.

Sponsored Recommendations

Ultra-Low Phase Noise MMIC Amplifier, 6 to 18 GHz

July 12, 2024
Mini-Circuits’ LVA-6183PN+ is a wideband, ultra-low phase noise MMIC amplifier perfect for use with low noise signal sources and in sensitive transceiver chains. This model operates...

Turnkey 1 kW Energy Source & HPA

July 12, 2024
Mini-Circuits’ RFS-2G42G51K0+ is a versatile, new generation amplifier with an integrated signal source, usable in a wide range of industrial, scientific, and medical applications...

SMT Passives to 250W

July 12, 2024
Mini-Circuits’ surface-mount stripline couplers and 90° hybrids cover an operational frequency range of DC to 14.5 GHz. Coupler models feature greater than 2 decades of bandwidth...

Transformers in High-Power SiC FET Applications

June 28, 2024
Discover SiC FETs and the Role of Transformers in High-Voltage Applications