Probe Station Reliably Handles 300-mm Wafers

Feb. 13, 2008
At 45 nm and below, testing geometries must confront many problems related to wafer-level measurements. Front-end processes and equipment must be upgraded to handle new process materials, lower operating voltages, and increasingly complex ...

At 45 nm and below, testing geometries must confront many problems related to wafer-level measurements. Front-end processes and equipment must be upgraded to handle new process materials, lower operating voltages, and increasingly complex integrated-circuit (IC) designs. A major investment also must be made at the back end in order for more advanced probing stations to handle low-noise environments, small pad probing, wide-range temperature testing, internal node probing, and multi-site testing. In addition, the need to ensure lower operating and bias voltages and the use of new materials have compounded the challenges of making accurate, low-level, on-wafer device measurements. To conquer such issues, the Elite 300 wafer probe station offers next-generation Pure-Line II performance based on a proprietary noise-reduction technology. As a result, the Elite 300 vows to enable up to 10 times lower spectral noise and four times better alternating-current (AC) noise. This probe station vows to reliably and accurately tackle 300-mm wafer probing for devices with process nodes at 45 nm and below. It offers end-to-end productivity improvements through characterization and modeling, wafer-level reliability, IC failure analysis, and design debug.

Cascade Microtech, Inc., 2430 NW 206th Ave., Beaverton, OR 97006; (503) 601-1000, FAX: (503) 601-1002, Internet: www.cascademicrotech.com.

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