RF CMOS Technology Used For CDMA2000 1X Chip Set

Dec. 4, 2003
QUALCOMM Incorp., developer of Code Division Multiple Access (CDMA) digital wireless technology, just announced new steps to reduce the cost of 3G CDMA devices with the development of its single-band RFR6122 and RFT6122 radioOne chips. The company ...

QUALCOMM Incorp., developer of Code Division Multiple Access (CDMA) digital wireless technology, just announced new steps to reduce the cost of 3G CDMA devices with the development of its single-band RFR6122 and RFT6122 radioOne chips. The company claims that these chipsets represent the first CDMA2000 1X chipsets to use cost-competitive RF CMOS rocess technology. CMOS is a low-cost, high-volume digital process technology used for most of today's digital computer microchips. By migrating RF designs to an RF CMOS-based process technology, cell phones and other wireless hand-held devices can leverage these significant economies of scale. This RF CMOS solution marks QUALCOMM's second-generation of radioOne Zero Intermediate Frequency (ZIF) architecture products. Combined with the PM6610 power management device and the MSM6025 Mobile Station Modem (MSM) baseband chipset, this new solution provides a suite of products. The main goal of these devices is to address the growing need for reliable, proven and cost-competitive solutions for emerging markets worldwide, including China, India and Latin America. Samples of the chipsets are expected to ship in the second quarter of 2004.

Qualcomm --> http://lists.planetee.com/cgi-bin3/DM/y/eA0CWyaL0Gth0BEBe0Ar

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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