Qorvo has been tapped by the U.S. Government to create a State-of-the-art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program will ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require design, validation, assembly, test, and manufacturing of next-generation RF components.
The exclusive SHIP Other Transaction Agreement (OTA), worth up to $75 million, was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division. Under the SHIP program, Qorvo will design and deliver the highest levels of heterogeneous packaging integration. This is essential to meet the size, weight, power, and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms, and satellite communications.
Qorvo's U.S.-based capabilities include advanced manufacturing, packaging and testing for both high- and low-power applications ranging from DC to 100 GHz. Qorvo holds a Defense Microelectronics Activity (DMEA) Category 1A trusted source certification for package assembly, test and wafer foundry services at its Richardson, TX location. Qorvo further provides defense customers with greater value by applying high-yield manufacturing and scale expertise gained from serving the commercial market.