0420 Mw Nxp Wi Fi 6 Promo 5ea1df6d9afa9

Portfolio Hastens Wi-Fi 6 Adoption in Multiple Arenas

April 23, 2020
With the standard’s adoption on the rise, NXP’s portfolio of Wi-Fi 6 (802.11ax) devices is expected to help push it into IoT/IIoT, automotive, and access markets.

A comprehensive Wi-Fi 6 (802.11ax) portfolio from NXP Semiconductors significantly expands the number of products and markets able to adopt the latest Wi-Fi standards. The company’s expanded Wi-Fi 6 portfolio represents an end-to-end vision and differentiated technology approach designed to help usher in an era of connectivity innovation for automotive, access, mobile, and IIoT/IoT markets.

WiFi 6 proliferation comes at a time when working from home is no longer a luxury but a necessity. The need for solid connectivity is exploding, and WiFi must mature to handle the increased load. WiFi 6 is a step in the right direction offering broader channel widths, a much higher data rate, higher modulation schemes, and, importantly, a superior means of controlling traffic within what is still a limited amount of spectrum.

Devices in the portfolio are said to provide up to 4x performance improvement, 30% greater range, improved battery life, and more reliable connectivity. These attributes will help drive WiFi 6 technology into smart homes, connected vehicles, and industrial machinery.

Included within the portfolio are:

·        4x4- and 8x8-stream devices (88W9064, 88W9068) with integrated Bluetooth 5 for home and enterprise access solutions,

·         Concurrent dual Wi-Fi 2x2+2x2 + Bluetooth 5 AEC-Q100 qualified devices (88Q9098) that are purpose-built for the highest performance infotainment and telematics automotive applications,

·         Concurrent dual Wi-Fi 2x2+2x2 + Bluetooth 5 devices (88W9098) offering best-in-class performance in multimedia streaming and consumer access applications,

·         And IoT-focused 2x2 WiFi 6 + Bluetooth 5 parts optimized for cost and power.

A critical part of the portfolio, NXP’s RF front-end devices based on silicon germanium (SiGe), can scale Wi-Fi 6 capabilities from low-to-high-end applications, including 1x1, 2x2, 4x4, and 8x8 multiple input, multiple output (MIMO) solutions.

The front-end devices offer a high level of integration in monolithic die. They are packaged in an ultra-compact 3 mm x 4 mm module optimized for mobile applications.

Yet another enabling technology for NXP’s end-to-end vision is its EdgeVerse portfolio of embedded processors, security, software, and turnkey solutions for distributed processing. Those products, coupled with the WiFi 6 devices, brings together a complete ecosystem for edge computing that enables smart connected devices to function seamlessly.

NXP Semiconductors, www.nxp.com

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