Visitors at this week’s 2019 IEEE International Microwave Symposium (IMS) and exhibition are being treated to many new products in support of the next generation of communications—5G cellular wireless systems. For its part, MACOM Technology Solutions is introducing one of the industry’s most broadband amplifiers in both chip and packaged forms: the 100-kHz to 50-GHz models MAAM-011238-DIE and MAAM-011238, respectively.
Ideal for 5G equipment and test applications, the bare die is usable at frequencies as high as 67.5 GHz. Since it works with a positive gate bias, the amplifier eliminates the need for a negative voltage supply and bias sequencer. It also has an integrated power detector to further simplify circuit board design. The miniature amplifiers will be on display at the company’s exhibition Booth 532, along with many new products for communications, radar, and test applications in commercial, industrial, and military markets.
Introduced at this week’s 2019 IEEE IMS exhibition, this extremely broadband mmWave amplifier is available in packaged (left) and chip (right) forms for use to at least 50 GHz. (Courtesy of MACOM Technology Solutions)
The model MAAM-011238 broadband amplifier is supplied in a 5- × 5-mm, 12-lead surface-mount-technology (SMT) package. It supplies 14-dB gain from 100 kHz to 50 GHz, with typical noise figure of 6 dB. It provides +17-dBm output power at 1-dB compression (P1dB) with an output third-order-intercept point (OIP3) of typically +26 dBm. In chip form, the amplifier die measures just 2.01 × 1.05 mm. Without the package (see figure), it offers slightly more gain, at 15 dB, and slightly less noise figure, at 5.5 dB. The typical P1B is +18 dBm while the OIP3 is typically +26 dBm. As noted, the chip covers the impressively wide bandwidth of 100 kHz to 67.5 GHz. In both forms, the amplifier draws 125 to 150 mA current from a +4- to +6-V dc supply.