IN ITS NEWEST iteration, an engineering simulation software vows to help engineers solve complex electromagnetic (EM) field problems quickly, accurately, and efficiently. HFSS 12.0 includes domain decomposition, a highperformance- computing (HPC) enhancement that allows engineers to address problems containing hundreds of millions of unknowns. This new technology allows efficient and highly scalable parallelized simulations across multiple computer cores including networked cores. Compared to a single-core direct solve, domain decomposition using eight cores exhibited an 8.8X speedup with a 33-percent memory savings when running a 15-GB benchmark on an HP 7880 workstation. HFSS 12.0 also includes updates in mesh generation, solver technologies, and enhancements to the user interface and modeler. For example, a faster and more robust meshing algorithm promises to generate higherquality, more efficient tetrahedral meshes. Among other enhancements are mixed-element orders, curvilinear elements, and adjoint derivative computation. Ease of use and automation in the user interface also have been improved. They include additional modeler capabilities like sheet wrapping and imprinting. Such advances allow electrical engineers to expand their solution capability, exploit HPC hardware, and fully integrate electromagnetics analysis into their Simulation Driven Product Development processes.
ANSYS, Inc., Southpointe, 275 Technology Dr., Canonsburg, PA 15317; (724) 746-3304, FAX: (724) 514-9494, Internet: www.ansys.com.
