Packaging and Substrate Solutions Gain Ground

A firm known for its ceramic packaging and substrate solutions has added a number of capabilities to its lineup, including copper-filled viaholes, copper-coated bore holes, and solder mask and assembly options. These capabilities enhance the design capabilities for packages and printed-circuit boards (PCBs) while also improving the reliability of designed based on the company’s manufacturing processes. The packages and substrates use the company’s plated copper on thick and thin film (PCTF) metallization for high reliability and effective thermal management.

Remtec, Inc., 100 Morse St., Norwood, MA 02062; (781) 762-9191, FAX: (781) 762-9777

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