EM Software Models Bond Wires

Related To:

June 14, 2012

The 2012 IMS features a wide range of in-booth simulation software demonstrations, including AWR's at booth No. 1514. In addition to sponsoring its traditional Customer Appreciation Party at IMSnot to mention a host of MicroApps presentations (on the exhibition floor, at booth No. 1223), the firm is showing its new three-dimensional (3D) finite-element-method (FEM) electromagnetic (EM) simulation software, Analyst 2012. This software has been developed to help analyze bond wires, tapered viaholes, and other circuit features. In addition, the company will show its popular suite of simulation tools in Microwave Office™, its system-level simulator, Virtual System Simulator™, and a number of other software tools.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.