It was recently announced that EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK would unify under a single brand identity: Smiths Interconnect. In this Q&A, Roland Carter, president of the combined entity, discusses this brand transition.
CD: First, can you tell us the reasoning behind this brand transition?
RC: Over time, interactions among our brands have increased across many of our markets. Aligning all this activity under the Smiths Interconnect name will make us a more streamlined partner, enhancing our customers’ access to the combined strength of our products, expertise, and application knowledge. This brand transition supports a recent strategic reorganization focused on creating a more agile structure that can better anticipate and respond to customers’ evolving needs.
CD: How will this transition impact customers of these brands?
RC: Unifying these technology brands under the single brand identity of ‘Smiths Interconnect’ will simplify customer access and interactions across multiple applications, making it easier to navigate between and communicate about the entire offering.
CD: Where do you now see Smiths Interconnect positioned in the RF/microwave industry?
RC: As a single brand that represents a breadth of solutions across connectors, microwave components, and microwave subsystems technologies, Smiths Interconnect is positioned as a comprehensive solutions provider. The shared expertise and market knowledge across our technology brand foundation paves the way for enhanced innovation and technology partnerships with customers.
Editor’s Note: A short description of the products and technologies of the individual brands is listed below.
EMC Technology: Board-level components incorporating resistive and signal distribution technologies.
Hypertac: Hyperboloid contact technology, electrical connectors, and interconnect solutions.
IDI: Spring probe contacts, interposers, connectors, and semiconductor test solutions.
Lorch Microwave: RF/microwave conditioning products using multiple topographies.
Millitech: Millimeter-wave components, antennas, assemblies, and integrated subsystems for satcom, test and measurement, radar, and scientific applications.
RF Labs: Microwave cable assemblies and coaxial components.
TECOM: Ground and airborne antenna systems for satcom, radio link, radar, telemetry, and high-bandwidth connectivity.
TRAK Microwave: Integrated microwave assemblies and subsystems, time and frequency systems, and ferrite components.
