WiFi Solution Puts Full Matched PAs On One Die

FOR CONSUMER APPLICATIONS like wireless networking, integration and higher performance are key. A new RF frontend solution for WiFi applications, dubbed the SE2566U, provides a pair of matched 2.4-GHz power amplifiers (PAs) on a single die to ...
Jan. 26, 2009

FOR CONSUMER APPLICATIONS like wireless networking, integration and higher performance are key. A new RF frontend solution for WiFi applications, dubbed the SE2566U, provides a pair of matched 2.4-GHz power amplifiers (PAs) on a single die to facilitate multiple- input multiple-output (MIMO) applications. Each amplifier delivers +19 dBm output power at 3-percent error vector magnitude (EVM) in 54-Mb/s IEEE 802.11g wireless-localarea- network (WLAN) systems and +21 dBm in IEEE 802.11b WLAN systems with adjacent-channel-powerratio (ACPR) performance of 30 dBc or better. The SE2566U includes an integrated receive path between the two transmit paths to provide maximum layout flexibility for 2-transmit by 2-receive (2x2) or 2x3 MIMO architectures. In addition, integrated filters ensure that the harmonic contribution of the PA is reduced to 50 dBm/ MHz. The SE2566U features an integrated load-insensitive transmit power detector offering 20 dB of dynamic range. A reference voltage generator allows 1.8-V CMOS digital-enable control directly from the baseband. It also eliminates the need for analog bias controls while drawing less than 1 A. P&A: $0.60 in volumes of 10,000; available now.

SiGe Semiconductor, 200 Brickstone Square, Suite 203, Andover, MA 01810; (978) 327-6850, FAX: (978) 475-0859, Internet: www.sige.com.

About the Author

Nancy Friedrich

Nancy Friedrich

RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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