For designers in need of printed-circuit materials (PCBs), a robust variety can be found at IMS 2014. Rogers Corp. (Booth No. 1833), to give one example, is displaying circuit laminates, in addition to materials for keeping them cool.Along with high-frequency materials such as RoHS-compliant RO4835 laminates with a dielectric constant of 3.48 and low loss tangent of 0.0037 at 10 GHz, Rogers will offer COOLSPAN TECA film, a thermosetting, epoxy-based, silver-filled adhesive for attaching PCBs to structures to keep them cool. Also, 2929 bondply material is a thin adhesive film well suited for forming reliable multilayer PCBs. Rogers’ Senior Market Development Engineer, John Coonrod, will offer a Microwave Application Seminar (MicroApps) at 9:35 AM on June 4th on understanding heating patterns within PCBs. And, finally, visitors to Booth No. 1833 should look inside their “gold” gift boxes to learn if they have won a Kindle Paperwhite portable communications device.
About the Author
Jack Browne
Technical Contributor
Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.