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Circuit Materials Handle The Heat

June 4, 2014
A full line of materials for RF/microwave applications includes adhesives for attachment to heatsinks and for forming multilayer assemblies.

For designers in need of printed-circuit materials (PCBs), a robust variety can be found at IMS 2014. Rogers Corp. (Booth No. 1833), to give one example, is displaying circuit laminates, in addition to materials for keeping them cool.Along with high-frequency materials such as RoHS-compliant RO4835 laminates with a dielectric constant of 3.48 and low loss tangent of 0.0037 at 10 GHz, Rogers will offer COOLSPAN TECA film, a thermosetting, epoxy-based, silver-filled adhesive for attaching PCBs to structures to keep them cool. Also, 2929 bondply material is a thin adhesive film well suited for forming reliable multilayer PCBs. Rogers’ Senior Market Development Engineer, John Coonrod, will offer a Microwave Application Seminar (MicroApps) at 9:35 AM on June 4th on understanding heating patterns within PCBs. And, finally, visitors to Booth No. 1833 should look inside their “gold” gift boxes to learn if they have won a Kindle Paperwhite portable communications device.

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