Cable Assemblies Keep PIM At Bay

July 11, 2012
When passive intermodulation (PIM) is a potential problem, the new SRX line of cable assemblies from San-tron can provide the solution.

When passive intermodulation (PIM) is a potential problem, the new SRX™ line of cable assemblies from San-tron can provide the solution. Designed for extremely low levels of PIM, these cables are formed with flexible-141, conformable-141, and semirigid RG-402 raw cable and a variety of terminating connector types, including SMA, Type N, 7/16, and TNC connectors. The cables show typical PIM levels of better than -157 dBc and can handle operating temperatures to +125ºC. The flexible versions of the low-PIM cable assemblies feature power-handling capabilities to 150 W at 2.5 GHz and suffer minimal insertion loss, with attenuation of 22 dB per 100 ft. of cable. The flexible cable assemblies can achieve a bend radius of only 0.2 in.

The cable assemblies are available in a variety of lengths, for short to long runs. For flame-retardant requirements, SRX assemblies employ TCOM-400-FR cables. For plenum-rated installations, they feature SFT-393 cables with a temperature rating to +165ºC. For short runs and jumper applications, the firm builds low-PIM assemblies with TCOM-240TM cable, to reach power levels of 160 W at 2.5 GHz, with attenuation of 13 dB per 100 ft. and a bend radius of 2.5 in. These assemblies handle operating temperatures to +85ºC and deliver PIM performance of -155 dBc.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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