Teledyne Paradise Datacom
GaN amplifiers

Outdoor SSPAs Deliver 500 W C-Band Output Power

Oct. 24, 2018
A pair of rack-mountable PAs has been designed for outdoor use, with capabilities of delivering 500 W output power at C-band and 300 W output power at Ku-band frequencies.

A pair of solid-state power amplifiers (SSPAs) has been designed for outdoor applications requiring high output power densities at C- and Ku-band frequencies. The SSPAs, which each measure 19.5 × 10.0 × 6.5 in. (495 × 254 × 165 mm) with a base weight of 44 lb. (20 kg) in rack-mountable enclosures, provide as much as 500 W continuous-wave (CW) output power at C-band frequencies and 300 W CW output power at Ku-band frequencies. The two amplifiers are part of an outdoor SSPA product line from Teledyne Paradise Datacom, a Teledyne Technologies Company. 

Based on gallium nitride (GaN) semiconductor technology, the rugged amplifiers are Conformite European (CE) and MIL-STD-461 compliant with 20-dB RF gain adjustment range and integrated forced-air cooling system. Each amplifier includes a universal power-factor-corrected power supply, RF output sample port, and true output-power detection. The amplifiers incorporate 1.0:1 redundancy control and are available with a variety of options, such as a reflected power monitor, antenna mounting kit, remote-control panel, and handheld controller for remote control.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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