LPKF Launches Desktop Electroplating System

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April 11, 2007

LPKF Laser & Electronics has introduced the MiniContac RS, a desktop electroplating system. The system is ideal for rapid prototyping of printed-circuit boards (PCBs) in tight spaces. The system employs reverse-pulse-plating (RPP) technology for uniform metal distribution. It can plate holes as small as 8-mil (0.2-mm) viaholes in 62-mil-thick standard PCBs. The system handles circuit boards as large as 9 x 13 inches (230 x 330 mm) and is completely closed with no external connection needed. It can also perform plating on through-holes in double-sided and multilayer boards. The system uses only four tanks, which can easily be replaced. LPKF can handle complete disposal of all plating chemicals.

LPKF Laser & Electronics

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.