Distribution of RF/microwave signals throughout high-frequency circuits and systems relies heavily on power splitters/combiners. As modern design trends shrink passive components like power splitters/combiners to ever-smaller sizes, a major challenge confronts designers: How does one manage reasonable levels of signal power without suffering the consequences of difficult-to-dissipate heat within a circuit or system design?...
Register or Sign in below to download the full article in .PDF format, including high resolution graphics and schematics when applicable.