Agilent, Aeroflex Partner For Mil Solutions

Oct. 9, 2008
Agilent Technologies and Aeroflex Microelectronic Solutions announced a strategic alliance to deliver industry-leading RF and microwave components and multichip modules (MCMs) for aerospace, satellite, and military applications using Agilent's ...

Agilent Technologies and Aeroflex Microelectronic Solutions announced a strategic alliance to deliver industry-leading RF and microwave components and multichip modules (MCMs) for aerospace, satellite, and military applications using Agilent's monolithic microwave integrated circuit (MMIC) technology.

According to Mark Pierpoint, Agilent's Vice-President and General Manager, "Agilent is fully committed to helping today's engineers create the best products for the aerospace and defense market by providing them with the components they need from early development through production. This partnership with Aeroflex Microelectronic Solutions reinforces our commitment to the high-reliability market." Tom Terlizzi, Vice-President and General Manager of Aeroflex Microelectronic Solutions, added "Aeroflex packaging and test capabilities combined with Agilent's proprietary MMIC solutions will provide RF and microwave engineers solutions for complex high-reliability communication designs. This partnership demonstrates Aeroflex's continued commitment to provide industry-leading solutions to the aerospace, satellite and defense markets."

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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